Cadence 6SigmaET Celsius EC Solver .1

Cadence has announced a new thermal analysis software, Celsius Thermal Solver. This simulator uses finite element analysis (FEA) and computational fluid dynamics (CFD) to detect overheating in ICs, PCBs, and device packages, taking into account heat generation, heat transfer, and convection heat transfer. Celsius obtains complete package design and PCB layout information from CAD tools, including Cadence Allegro or OrCAD PCB CAD designs. Moreover, Celsius can obtain information about the detailed design of the chip itself when it comes to analyzing heat dissipation and heating inside its package. This functionality may be of interest to domestic developers of processor chips who use Cadence CAD for designing VLSI and chip packages/wafers (CAD for developing Cadence Allegro Package D substrates.